Staircase etch control in forming three-dimensional memory device

ABSTRACT

Embodiments of three-dimensional (3D) memory devices and methods for controlling a photoresist (PR) trimming rate in the formation of the 3D memory devices are disclosed. In an example, a method includes forming a dielectric stack over a substrate, measuring a first distance between the first trimming mark and the PR layer along a first direction, and trimming the PR layer along the first direction. The method also includes etching the dielectric stack using the trimmed PR layer as an etch mask to form a staircase, forming a second trimming mark using the first trimming mark as an etch mask, measuring a second distance between the second trimming mark and the trimmed PR layer, comparing the first distance with the second distance to determine a difference between an actual PR trimming rate and an estimated PR trimming rate, and adjusting PR trimming parameters based on the difference.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority to Chinese Patent Application No.201710134787.4 filed on Mar. 8, 2017 and PCT Patent Application No.PCT/CN2018/077931 filed on Mar. 2, 2018, the entire content of which isincorporated herein by reference.

BACKGROUND

Embodiments of the present disclosure relate to three-dimensional (3D)memory devices and fabrication methods thereof.

Planar memory cells are scaled to smaller sizes by improving processtechnology, circuit design, programming algorithm, and fabricationprocess. However, as feature sizes of the memory cells approach a lowerlimit, planar process and fabrication techniques become challenging andcostly. As a result, memory density for planar memory cells approachesan upper limit.

A 3D memory architecture can address the density limitation in planarmemory cells. 3D memory architecture includes a memory array andperipheral devices for controlling signals to and from the memory array.

BRIEF SUMMARY

Embodiments of 3D memory architectures and fabrication methods thereofare disclosed herein.

According to some embodiments of the present disclosure, a method forcontrolling a photoresist (PR) trimming rate in a PR trimming process,includes forming a PR layer over a first region of a substrate, forminga first trimming mark in a second region neighboring the first region,and trimming the PR layer. The method can also include measuring a firstdistance between the first trimming mark and the PR layer along a firstdirection parallel to a top surface of the substrate to determine anactual PR trimming rate of the PR trimming process along the firstdirection, comparing the actual PR trimming rate along the firstdirection with an estimated PR trimming rate along the first directionto determine a first difference between the actual PR trimming ratealong the first direction and the estimated PR trimming rate along thefirst direction, and adjusting PR trimming parameters of the PR trimmingprocess based on the first difference.

In some embodiments, the first trimming mark is formed by patterning thesecond region of the substrate.

In some embodiments, the first trimming mark includes one or more of aprotruding structure and a recessed structure.

In some embodiments, the first trimming mark includes a rectangularshape, a circular shape, an irregular shape, a squared shape, and acombination thereof.

In some embodiments, the method further includes forming a secondtrimming mark over the second region and measuring a second distancebetween the second trimming mark and the PR layer along a seconddirection parallel to the top surface of the substrate to determine anactual PR trimming rate of the PR trimming process along the seconddirection. The actual PR trimming rate along the second direction iscompared with an estimated PR trimming rate along the second directionto determine a second difference between the actual PR trimming ratealong the second direction and the estimated PR trimming rate along thesecond direction. The PR trimming parameters of the PR trimming processare adjusted based on the second difference.

In some embodiments, the first direction and the second direction aredifferent from one another.

In some embodiments, the second trimming mark and the first trimmingmark are formed by a same patterning process.

In some embodiments, the second trimming mark and the first trimmingmark have same or different shapes.

In some embodiments, the second region includes one or more of a planarsurface and a 3D surface.

According to some embodiments of the present disclosure, a method forcontrolling a PR trimming rate in a PR trimming process, includesproviding an estimated PR trimming rate, determining an actual PRtrimming rate, and comparing the actual PR trimming rate and theestimated PR trimming rate to determine a difference between the actualPR trimming rate and the estimated PR trimming rate. In response to thedifference being greater than the threshold, one or more PR trimmingparameters for the PR trimming process can be adjusted. Accordingly, theactual PR trimming rate is the same as the estimated PR trimming rate.

In some embodiments, an adjustment of the one or more PR trimmingparameters is proportional to a value of the difference.

According to some embodiments of the present disclosure, a method forcontrolling a PR trimming rate in a PR trimming process for forming athree-dimensional memory structure includes forming a dielectric stackover a substrate, the dielectric stack including a plurality ofsacrificial material layers and a plurality of insulating materiallayers arranged alternatingly, trimming a PR layer over the dielectricstack, etching the dielectric stack, using the trimmed PR layer as anetch mask, to form a plurality of staircases, and forming a firsttrimming mark for the trimmed PR layer. The method also includesmeasuring a first distance between the first trimming mark and thetrimmed PR layer along a first direction parallel to the top surface ofthe substrate to determine an actual PR trimming rate of the PR trimmingprocess along the first direction, comparing the actual PR trimming ratealong the first direction with an estimated PR trimming rate along thefirst direction to determine a first difference between the actual PRtrimming rate along the first direction and the estimated PR trimmingrate along the first direction; and adjusting one or more PR trimmingparameters of the PR trimming process based on the first difference.

In some embodiments, forming a first trimming mark includes forming thefirst trimming mark over one or more of the dielectric stack and aregion neighboring the dielectric stack.

In some embodiments, forming the first trimming mark includes patterningthe one or more of the dielectric stack and the region neighboring thedielectric stack to form an initial trimming mark, and etching,repetitively, the dielectric stack using the initial trimming mark as anetch mask to form the first trimming mark.

In some embodiments, the first trimming mark has one or more of aprotruding structure and a recessed structure.

In some embodiments, the protruding structure includes a height of athickness of a staircase and the recessed structure includes a depth ofthe thickness of the staircase.

In some embodiments, the method further includes forming a secondtrimming mark for the trimmed PR layer over the dielectric stack,measuring a second distance between the second trimming mark and thetrimmed PR layer along a second direction parallel to the top surface ofthe substrate to determine an actual PR trimming rate of the PR trimmingprocess along the second direction, and comparing the actual PR trimmingrate along the second direction with an estimated PR trimming rate alongthe second direction to determine a second difference between the actualPR trimming rate along the second direction and the estimated PRtrimming rate along the second direction. In some embodiments, themethod also includes adjusting the one or more PR trimming parameters ofthe PR trimming process based on the second difference.

In some embodiments, the second trimming mark and the first trimmingmark are formed by a same patterning process.

In some embodiments, the second trimming mark and the first trimmingmark have a same shape.

In some embodiments, the second direction is same as the firstdirection.

In some embodiments, the method further includes forming a thirdtrimming mark for the trimmed PR layer over the region neighboring thedielectric stack, measuring a third distance between the third trimmingmark and the PR layer along a third direction parallel to the topsurface of the substrate to determine an actual PR trimming rate of thePR trimming process along the third direction, comparing the actual PRtrimming rate along the third direction with an estimated PR trimmingrate along the third direction to determine a third difference betweenthe actual PR trimming rate along the third direction and the estimatedPR trimming rate along the third direction, and adjusting the PRtrimming parameter of the PR trimming process based on the thirddifference.

In some embodiments, the region neighboring the dielectric stackincludes one or more of a planar surface and a three-dimensionalsurface.

In some embodiments, the third direction is different from the firstdirection.

In some embodiments, the method further includes controlling thetrimming of the PR layer based on the adjusted one or more PR trimmingparameters.

In some embodiments, the method further includes controlling a trimmingof an other PR layer based on the adjusted one or more PR trimmingparameters, and etching an other dielectric stack, using the othertrimmed PR layer as an etch mask, to form an other plurality ofstaircases.

According to some embodiments of the present disclosure, a 3D memorystructure includes a substrate and a staircase structure disposed overthe substrate, the staircase structure including a plurality ofconductor layers and a plurality of insulating layers arrangedalternatingly. In some embodiments, a conductor layer and an insulatinglayer adjacent to the conductor layer form a staircase, and a firsttrimming mark over one or more of the staircase structure and a regionneighboring the staircase structure over the substrate. In someembodiments, the first trimming mark has one or more of a protrudingstructure and a recessed structure.

In some embodiments, the first trimming mark has a same thickness as thestaircase.

In some embodiments, the first trimming mark is over one staircase ofthe staircase structure.

In some embodiments, the first trimming mark includes a rectangularshape, a circular shape, an irregular shape, a squared shape, or acombination thereof.

In some embodiments, the structure further includes a second trimmingmark disposed over another staircase of the staircase structure, thesecond trimming mark having a same thickness and same shape as the firsttrimming mark.

In some embodiments, the staircases of the staircase structure arealigned along a first direction and the first trimming mark and thesecond trimming mark are aligned along a direction that has an angle tothe first direction.

According to some embodiments of the present disclosure, a method forcontrolling a PR trimming rate in a PR trimming process for forming athree-dimensional memory structure includes forming a dielectric stackover a substrate, the dielectric stack including a plurality ofsacrificial material layers and a plurality of insulating materiallayers arranged alternatingly. A PR layer can be disposed over thedielectric stack. The method also includes forming a first trimming markfor the PR layer, measuring a first distance between the first trimmingmark and the PR layer along a first direction parallel to the topsurface of the substrate, trimming the PR layer along the firstdirection, and etching the dielectric stack, using the trimmed PR layeras an etch mask, to form a staircase. The method further includesforming a second trimming mark, using the first trimming mark as an etchmask, for the trimmed PR layer, measuring a second distance between thesecond trimming mark and the trimmed PR layer along the first direction,comparing the first distance with the second distance to determine adifference between an actual PR trimming rate and an estimated PRtrimming rate along the first direction, and adjusting one or more PRtrimming parameters of the PR trimming process based on the difference.

In some embodiments, forming a first trimming mark includes forming thefirst trimming mark over one or more of the dielectric stack and aregion neighboring the dielectric stack.

In some embodiments, forming the first trimming mark includes patterningthe one or more of the dielectric stack and the region neighboring thedielectric stack to form an initial trimming mark, and etching,repetitively, the dielectric stack using the initial trimming mark as anetch mask to form the first trimming mark.

In some embodiments, the first trimming mark has one or more of aprotruding structure and a recessed structure.

In some embodiments, the protruding structure includes a height of athickness of a staircase and the recessed structure includes a depth ofthe thickness of the staircase.

In some embodiments, the region over the dielectric stack and the regionneighboring the dielectric stack include one or more of a planar surfaceand a three-dimensional surface.

In some embodiments, the method further includes controlling thetrimming of the trimmed PR layer based on the adjusted one or more PRtrimming parameters, and etching the dielectric stack using the trimmedPR layer as an etch mask to form an other staircase.

In some embodiments, the method further includes controlling a trimmingof an other PR layer based on the adjusted one or more PR trimmingparameters, and etching an other dielectric stack using the othertrimmed PR layer as an etch mask to form an other staircase.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated herein and form a partof the specification, illustrate embodiments of the present disclosureand, together with the description, further serve to explain theprinciples of the present disclosure and to enable a person skilled inthe pertinent art to make and use the present disclosure.

FIG. 1A illustrates an exemplary 3D memory structure, according to someembodiments.

FIG. 1B illustrates a top view of the 3D memory structure in FIG. 1A.

FIG. 2A illustrates a top view of an exemplary 3D memory structure,according to some embodiments.

FIG. 2B illustrates a cross-sectional view of the 3D memory structure inFIG. 2A.

FIG. 3A illustrates a top view of an exemplary 3D memory structure,according to some embodiments.

FIG. 3B illustrates a cross-sectional view of the 3D memory structure inFIG. 3A.

FIG. 4A illustrates a top view of an exemplary 3D memory structure,according to some embodiments.

FIG. 4B illustrates a cross-sectional view of the 3D memory structure inFIG. 4A.

FIG. 5A illustrates a top view of an exemplary 3D memory structure,according to some embodiments.

FIG. 5B illustrates a cross-sectional view of the 3D memory structure inFIG. 5A.

FIG. 6A illustrates a top view of an exemplary 3D memory structure,according to some embodiments.

FIG. 6B illustrates a cross-sectional view of the 3D memory structure inFIG. 6A.

FIG. 7A illustrates a top view of an exemplary 3D memory structure,according to some embodiments.

FIG. 7B illustrates a cross-sectional view of the 3D memory structure inFIG. 7A.

FIG. 8A illustrates a top view of an exemplary 3D memory structure,according to some embodiments.

FIG. 8B illustrates a cross-sectional view of the 3D memory structure inFIG. 8A.

FIG. 9A illustrates a top view of an exemplary 3D memory structure,according to some embodiments.

FIG. 9B illustrates a cross-sectional view of the 3D memory structure inFIG. 9A.

FIG. 10A illustrates a top view of an exemplary 3D memory structure,according to some embodiments.

FIG. 10B illustrates a cross-sectional view of the 3D memory structurein FIG. 10A.

FIG. 11A illustrates a top view of an exemplary 3D memory structure,according to some embodiments.

FIG. 11B illustrates a cross-sectional view of the 3D memory structurein FIG. 11A.

FIG. 12A illustrates a top view of an exemplary 3D memory structure,according to some embodiments.

FIG. 12B illustrates a cross-sectional view of the 3D memory structurein FIG. 12A.

FIG. 13A illustrates a top view of an exemplary 3D memory structure,according to some embodiments.

FIG. 13B illustrates a cross-sectional view of the 3D memory structurein FIG. 13A.

FIG. 14A illustrates a top view of an exemplary 3D memory structure,according to some embodiments.

FIG. 14B illustrates a cross-sectional view of the 3D memory structurein FIG. 14A.

FIG. 15A illustrates a top view of an exemplary 3D memory structure,according to some embodiments.

FIG. 15B illustrates a cross-sectional view of the 3D memory structurein FIG. 15A.

FIG. 16A illustrates a top view of an exemplary 3D memory structure,according to some embodiments.

FIG. 16B illustrates a cross-sectional view of the 3D memory structurein FIG. 16A.

FIG. 17A illustrates a top view of an exemplary 3D memory structure,according to some embodiments.

FIG. 17B illustrates a cross-sectional view of the 3D memory structurein FIG. 17A.

FIG. 18 illustrates a top view of an exemplary 3D memory structure,according to some embodiments.

FIG. 19 illustrates an enlarged view of a portion of the 3D memorystructure in FIG. 18.

FIG. 20 illustrates a cross-sectional view of an exemplary 3D memorystructure, according to some embodiments.

FIGS. 21A and 21B each illustrates a cross-sectional view of anexemplary 3D memory structure, according to some embodiments.

FIG. 22 is a flowchart of an exemplary method for forming trimmingmarks, according to some embodiments.

FIG. 23 is a flowchart of an exemplary method for PR trimming ratecontrol, according to some embodiments.

FIG. 24 is a flowchart of an exemplary method for PR trimming ratecontrol using a feedback loop, according to some embodiments.

Embodiments of the present disclosure will be described with referenceto the accompanying drawings.

DETAILED DESCRIPTION

Although specific configurations and arrangements are discussed, itshould be understood that this is done for illustrative purposes only. Aperson skilled in the pertinent art will recognize that otherconfigurations and arrangements can be used without departing from thespirit and scope of the present disclosure. It will be apparent to aperson skilled in the pertinent art that the present disclosure can alsobe employed in a variety of other applications.

It is noted that references in the specification to “one embodiment,”“an embodiment,” “an example embodiment,” “some embodiments,” etc.,indicate that the embodiment described may include a particular feature,structure, or characteristic, but every embodiment may not necessarilyinclude the particular feature, structure, or characteristic. Moreover,such phrases do not necessarily refer to the same embodiment. Further,when a particular feature, structure or characteristic is described inconnection with an embodiment, it would be within the knowledge of aperson skilled in the pertinent art to effect such feature, structure orcharacteristic in connection with other embodiments whether or notexplicitly described.

In general, terminology may be understood at least in part from usage incontext. For example, the term “one or more” as used herein, dependingat least in part upon context, may be used to describe any feature,structure, or characteristic in a singular sense or may be used todescribe combinations of features, structures or characteristics in aplural sense. Similarly, terms, such as “a,” “an,” or “the,” again, maybe understood to convey a singular usage or to convey a plural usage,depending at least in part upon context. In addition, the term “basedon” may be understood as not necessarily intended to convey an exclusiveset of factors and may, instead, allow for existence of additionalfactors not necessarily expressly described, again, depending at leastin part on context.

It should be readily understood that the meaning of “on,” “above,” and“over” in the present disclosure should be interpreted in the broadestmanner such that “on” not only means “directly on” something but alsoincludes the meaning of “on” something with an intermediate feature or alayer therebetween, and that “above” or “over” not only means themeaning of “above” or “over” something but can also include the meaningit is “above” or “over” something with no intermediate feature or layertherebetween (i.e., directly on something).

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper,” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

As used herein, the term “substrate” refers to a material onto whichsubsequent material layers are added. The substrate itself can bepatterned. Materials added on top of the substrate can be patterned orcan remain unpatterned. Furthermore, the substrate can include a widearray of semiconductor materials, such as silicon, germanium, galliumarsenide, indium phosphide, etc. Alternatively, the substrate can bemade from an electrically non-conductive material, such as a glass, aplastic, or a sapphire wafer.

As used herein, the term “layer” refers to a material portion includinga region with a thickness. A layer can extend over the entirety of anunderlying or overlying structure, or may have an extent less than theextent of an underlying or overlying structure. Further, a layer can bea region of a homogeneous or inhomogeneous continuous structure that hasa thickness less than the thickness of the continuous structure. Forexample, a layer can be located between any pair of horizontal planesbetween, or at, a top surface and a bottom surface of the continuousstructure. A layer can extend horizontally, vertically, and/or along atapered surface. A substrate can be a layer, can include one or morelayers therein, and/or can have one or more layer thereupon, thereabove,and/or therebelow. A layer can include multiple layers. For example, aninterconnect layer can include one or more conductor and contact layers(in which contacts, interconnect lines, and/or vias are formed) and oneor more dielectric layers.

As used herein, the term “nominal/nominally” refers to a desired, ortarget, value of a characteristic or parameter for a component or aprocess operation, set during the design phase of a product or aprocess, together with a range of values above and/or below the desiredvalue. The range of values can be due to slight variations inmanufacturing processes or tolerances. As used herein, the term “about”indicates the value of a given quantity that can vary based on aparticular technology node associated with the subject semiconductordevice. Based on the particular technology node, the term “about” canindicate a value of a given quantity that varies within, for example,10-30% of the value (e.g., ±10%, ±20%, or ±30% of the value).

As used herein, the term “3D memory device” refers to a semiconductordevice with vertically oriented strings of memory cell transistors(referred to herein as “memory strings,” such as NAND strings) on alaterally-oriented substrate so that the memory strings extend in thevertical direction with respect to the substrate. As used herein, theterm “vertical/vertically” means nominally perpendicular to the lateralsurface of a substrate.

In 3D memory device architectures, memory cells for storing data arevertically stacked to form a stacked storage structure. 3D memorydevices usually include a staircase structure formed on one or moresides of the stacked storage structure for purposes such as word linefan-out. As the demand for higher storage capacity continues toincrease, the number of vertical levels of the stacked storage structurealso increases. Accordingly, a thicker photoresists (PR) layer is neededto etch the staircase structure with increased levels. However, theincrease of thickness of the PR layer can make the etch control of thestaircase structure more challenging.

In the present disclosure, a staircase structure refers to a set ofsurfaces that include at least two horizontal surfaces (e.g., along x-yplane) and at least two (e.g., first and second) vertical surfaces(e.g., along z-axis) such that each horizontal surface is adjoined to afirst vertical surface that extends upward from a first edge of thehorizontal surface, and is adjoined to a second vertical surface thatextends downward from a second edge of the horizontal surface. A “step”or “staircase” refers to a vertical shift in the height of a set ofadjoined surfaces. In the present disclosure, term “staircase” and term“step” refer to one level of a staircase structure and are usedinterchangeably. In the present disclosure, a horizontal direction canrefer to a direction (e.g., the x-axis or the y-axis) parallel with thetop surface of the substrate (e.g., the substrate that provides thefabrication platform for formation of structures over it), and avertical direction can refer to a direction (e.g., the z-axis)perpendicular to the top surface of the structure.

In some embodiments, a staircase structure can be formed from adielectric stack layer (e.g., material layer), which includes aplurality of alternatingly arranged dielectric pairs (e.g., insulatingmaterial layer/sacrificial material layer pair) by repetitively etchingthe dielectric pairs using a PR layer formed over the dielectric stacklayer. The insulating material layer and the underlying sacrificialmaterial layer in one dielectric pair can have nominally the same heightover the substrate so that one pair can form one step, in someembodiments. During the formation of the staircase structure, the PRlayer is trimmed (e.g., etched incrementally and inwardly from theboundary of the dielectric stack layer, often from all directions) andused as the etch mask for etching the exposed portion of the dielectricstack. The amount of trimmed PR can be directly relevant (e.g.,determinant) to the dimensions of the staircases. The trimming of the PRlayer can be obtained using a suitable etch, e.g., an isotropic dry etchor a wet etch. One or more PR layers can be formed and trimmedconsecutively for the formation of the staircase structure. Eachdielectric pair can be etched, after the trimming of the PR layer, usingsuitable etchants to remove a portion of both the insulating materiallayer and the underlying sacrificial material layer. The etchedinsulating material layer and the sacrificial material layers arereferred to as insulating layers and sacrificial layers. After theformation of the staircase structure, the PR layer can be removed andthe sacrificial layers can be replaced with metal/conductor layers(e.g., tungsten). The metal/conductor layers can form the gateelectrodes (or word lines) of the 3D memory structure.

In the present disclosure, the terms “the actual PR trimming rate” and“the measured PR trimming rate” are interchangeable, both referring tothe PR trimming rate extracted from measurement under a specificreaction condition; the term “the PR trimming parameters” refers to thesystem parameters (e.g., pressure, power level, and gas flow rates) thatcan affect the actual PR trimming rate; and the term “theestimated/calculated PR trimming rate” refers to the PR trimming rate(e.g., ideal PR trimming rate) determined by design and/or calculationprior to the fabrication process.

In the present disclosure, the term “SC” refers to a staircase, and theterm “staircase-forming area” or the like refers to the horizontalarea/region for forming the staircase. The projected area of astair-case forming area on the top surface of the substrate staysunchanged during the fabrication. For example, a “first staircase(SC1)-forming area” refers to the horizontal area for forming the firststaircase (e.g., the lowest staircase along the vertical direction)after the fabrication is completed. Accordingly, a trimming mark formedin SC1-forming area at the beginning of the fabrication process canundergo a plurality of repetitive etches, and the pattern and horizontallocation of the trimming mark can be preserved or stay nominallyunchanged when the etching is completed. A trimming mark can then beformed over the first staircase after the fabrication/etch is completed.The trimming mark formed over the first staircase can have the samepattern and horizontal location of the trimming mark formed at thebeginning of the fabrication process. In the figures of the presentdisclosure, A1, . . . , An represent SC1-forming area, . . . , andSCn-forming area, respectively. Accordingly, SC1, . . . , SCn can beformed in A1, . . . , An, respectively.

The present disclosure provides a staircase structure in a 3D memorydevice, methods for forming the structure, and control methods relatedto the structure. The disclosed staircase structure includes a pluralityof trimming marks distributed over and/or neighboring the structure. Thetrimming marks can be formed before and/or during the formation of thestaircase structure. The trimming marks can be used to controland/adjust the trimming/etch rate of the photoresist (PR) layer beforeand/or during the formation of the staircase structure so that theformation of the staircases/steps of the staircase structure can be moreprecisely controlled. For example, the trimming marks can be used todetermine the actual PR trimming rate in the formation of the currentbatch (also known as “lot”) of staircase structures, and thedetermined/current PR trimming rate can be used to adjust or determinethe actual PR trimming rate in the formation of the next batch ofstaircase structures. In another example, the current PR trimming ratecan be used to determine and/or adjust the PR trimming parameters in thesubsequent PR etching/trimming operations of the same batch of staircasestructures. Using the methods and structures disclosed herein, the PRlayer for forming the staircases of the staircase structure can betrimmed at a desired (e.g., more uniform or more controllable) rate,such that the etching process of the staircases of the staircasestructure can be easier to monitor and control. Thus, the formation ofthe staircase structure (e.g., the steps of the staircase structure) isless susceptible to the increase of staircase/pair numbers, and thestaircases can have desired lengths (e.g., lengths close to designedlengths).

FIG. 1A illustrates a staircase structure 100 in a 3D memory device, andFIG. 1B illustrates a top view 101 of staircase structure 100 along thevertical direction (e.g., the z-axis), according to some embodiments. Insome embodiments, staircase structure 100 is a portion of a patterneddielectric stack of the 3D memory device. For illustrative purposes,each staircase is represented by “SC.” For example, the first staircaseis represented by “SC1,” and so on. As shown in FIG. 1A, staircasestructure 100 includes a plurality of staircases/steps, each staircasecontaining a dielectric pair. In some embodiments, a dielectric pairincludes an insulating layer and an underlying sacrificial layer. Theinsulating layer and the sacrificial layer can each include a suitablematerial. For example, the sacrificial layer can include siliconnitride, and the insulating layer can include silicon oxide. Forillustrative purposes, in the present disclosure, the sacrificial layeris represented by “N” and the insulating layer is represented by “O.” Asshown in FIGS. 1A and 1B, staircase structure 100 includes a pluralityof staircases (e.g., SC1, SC2, . . . , SCn) arranged along the z-axis.In some embodiments, each staircase has a different length along thex-axis and the length decreases upwardly along the z-axis. Staircasestructure 100 can be formed over a substrate 105, which provides thefabrication base for the subsequent processing of staircase structure100. The plurality of alternatingly arranged insulating layers andsacrificial layers are represented by element 110. Staircase structure100 can include a top surface 109. Top surface 109 can be the topsurface of an insulating material layer and can provide the fabricationbase for other structures (e.g., bit lines) formed over staircasestructure 100 in subsequent fabrication operations. For illustrativepurposes, other structures over staircase structure 100 are omitted fromthe present disclosure.

In some embodiments, substrate 105 includes any suitable material forforming the 3D memory structure. For example, substrate 105 can includesilicon, silicon germanium, silicon carbide, silicon on insulator (SOI),germanium on insulator (GOI), glass, gallium nitride, gallium arsenide,and/or other suitable III-V compounds.

In some embodiments, staircase structure 100 includes an alternatingstack of insulating layers “O” and sacrificial layers “N” arrangedvertically (along the z-axis) over substrate 105. The thickness of thetop insulating layer “O” can be the same as or different from thethickness of other insulating layers “O.” In some embodiments,sacrificial layers N are removed subsequently for depositing gate metalmaterial (e.g., a conductor) for forming word lines of the 3D memorydevice. In some embodiments, sacrificial layers N include any suitablematerial different from insulating layers O. For example, sacrificiallayers N can include poly-crystalline silicon, silicon nitride,poly-crystalline germanium, and/or poly-crystalline germanium-silicon.In some embodiments, sacrificial layers N include silicon nitride.Insulating layers O can include any suitable insulating materials, e.g.,silicon oxide. Staircase structure 100 can be formed by alternatinglydepositing sacrificial material layers and insulating material layersover substrate 105 and subsequently etching each dielectric pair to formstaircases along the z-axis. For example, a sacrificial material layercan be deposited over substrate 105, and an insulating material layercan be deposited on the sacrificial material layer, and so on and soforth. The deposition of sacrificial material layers and insulatingmaterial layers can include any suitable deposition methods such aschemical vapor deposition (CVD), physical vapor deposition (PVD),plasma-enhanced CVD (PECVD), sputtering, metal-organic chemical vapordeposition (MOCVD), and/or atomic layer deposition (ALD). In someembodiments, the sacrificial material layers and the insulating materiallayers are each formed by CVD.

Referring to FIGS. 1A and 1B, staircase structure 100 can include aplurality of trimming marks (e.g., elements 106, 107, and 108)distributed over the top surfaces of the staircases. For illustrativepurposes, trimming marks formed in regions neighboring staircasestructure 100 are not shown in FIGS. 1A and 1B. Staircase structure 100can include any suitable number of staircases. For example, staircasestructure 100 can include 64 staircases. For illustrative purposes, onlystaircases at the bottom and the top of staircase structure 100 (e.g.,SC1-4 and SCn) and the trimming marks over these staircases (e.g.,106-108) are shown. The trimming marks can be arranged in any suitablepatterns, such as aligned along the x-axis, aligned at an angle to thex-axis, etc. The trimming marks can be formed on each staircase (e.g.,the number of the trimming marks is equal to the number of staircases),or not at every staircase (as the example shown in FIG. 1A). Thedistance (e.g., vertical or horizontal) between two adjacent (e.g.,closest) trimming marks can be uniform or can vary. The trimming markscan be distributed from the bottom to the top of staircase structure 100(as the example shown in FIG. 1A) or can be distributed at any portionof staircase structure 100. The trimming marks can have any suitableshapes such as squared shapes, rectangular shapes, “L” shapes, irregularshapes, and/or circular shapes, depending on the measurementrequirements. A trimming mark can be formed at any location of astaircase. For example, a trimming mark can be formed on an edge orbetween the edges of a staircase. The trimming marks can includeprotruding structures, recessed structures, and/or a combination ofboth. In some embodiments, the trimming marks are formed from the samematerial of a dielectric pair, e.g., including a layer of insulatingmaterial and a layer of sacrificial material. The plurality of trimmingmarks can include trimming marks of the same shape or of differentshapes. For example, an “L-shaped” trimming mark can be arranged at acorner (not shown) of staircase structure 100 and rectangular trimmingmarks can be arranged at other locations of staircase structure 100. Thearrangement, shape, number, and pattern of the trimming marks over astaircase structure should be determined based on the actual measurementrequirement and should not be limited by the embodiments of the presentdisclosure.

The trimming marks can be formed before or during the formation ofstaircase structure 100. For example, the trimming marks can be formedover the dielectric stack before the trimming of the PR layer foretching the dielectric pairs. In another example, the trimming marks canbe formed during the etching of the staircases, e.g., before forming asubsequent PR layer for the etching of the subsequent dielectric pairsor between the etching of two adjacent dielectric pairs. Because thelocation and the height/depth (along the z-axis) of a trimming mark canmaintain nominally constant during the formation of staircase structure100, the trimming marks can be used as references to determine thetrimming/etch rate of the PR layer (or the etch rate of the staircases).For example, the horizontal distance (e.g., along the x-axis) between atrimming mark and the PR layer can be measured and recorded to determinethe actual PR trimming rate. The measured PR trimming rate can becompared with a predetermined PR trimming rate (or calculated/estimatedtrimming rate, based on design) to determine the deviation between theactual PR trimming rate and the estimated PR trimming rate. The actualPR trimming rate for the subsequent etches of next batch of staircasestructures and/or next staircases of the current batches can thus beadjusted based on the difference. The etching of the staircases is thusmore controllable and the staircases can be etched to desired lengthsaccordingly.

For example, referring to FIG. 1B, staircase structure 100 includes aplurality of trimming marks distributed over a plurality of staircases.In some embodiments, the trimming marks can have the same shape and canbe aligned along a line that has an angle to the x-axis. In someembodiments, the shape can be rectangular. In some embodiments, each twoadjacent trimming marks (e.g., 106 and 107 formed over A1 and A4,respectively) are separated by two staircases (e.g., formed over A2 andA3). In some embodiments, the trimming marks are formed between theedges, e.g., nominally at the middle position along the x-axis, of thecorresponding staircases. In some embodiments, the trimming marks areformed from a dielectric pair (O, N), and the height/depth of a trimmingmark is nominally equal to the thickness of the dielectric pair. FIGS.2A-17B illustrate different formation methods of trimming marks atvarious stages of fabrication processes.

FIGS. 2A, 2B, 3A, 3B, 4A, 4B, 5A, 5B, 6A, and 6B illustrate an exemplaryformation method of trimming marks in staircase structure 100, accordingto some embodiments. Using the fabrication process shown in FIGS. 2A-6B,trimming marks with a protruding structure can be formed. FIG. 2Aillustrates a top view 200 of staircase structure 100 at the beginningof an exemplary fabrication process. FIG. 2B illustrates across-sectional view of staircase structure 100 along 2-2′ direction.

At the beginning of the fabrication process, a substrate 105, includinga dielectric stack 210 formed over substrate 105, can be provided.Substrate 105 can include any suitable semiconductor material, anddielectric stack 210 can include a plurality of sacrificial materiallayers (N) and a plurality of insulating material layers (0)alternatingly arranged as a stack. The sacrificial material layers andthe insulating material layers can include different materials. In someembodiments, substrate 105 includes silicon, sacrificial material layersN include silicon nitride, and insulating material layers O includesilicon oxide. An insulating material layer O and the underlyingsacrificial material layer N can form a dielectric pair. The stackeddielectric pairs can be etched subsequently using a PR layer to desiredlengths, forming staircases or steps. The PR layer can be repetitivelytrimmed horizontally (along the x-y plane) and vertically (along thez-axis) for the repetitive etching of the dielectric pairs. In someembodiments, stack 210 includes 64 dielectric pairs, which can form upto 64 staircases. For ease of description, only the dielectric pairsassociated with the description of the fabrication process are shown.

A PR layer can be formed and patterned over dielectric stack 210. Insome embodiments, a positive photoresist is used and patterned to coverportions/locations of the trimming marks. As shown in FIGS. 2A and 2B,PR portions 206, 207, . . . , 208 can be formed over dielectric stack210 and used as etch masks in a subsequent etching process so that theportions of the top dielectric pair of dielectric stack 210 exposed bythe PR portions can be removed in a subsequent etching process.

Further, an etching process (e.g., a first etching process) can beperformed to remove the portions of dielectric stack 210 exposed by thePR portions. Any suitable etchants (e.g., of wet etch and/or dry etch)can be used to sequentially remove the insulating material layer O andthe sacrificial material layer N of the first/top dielectric pair. Insome embodiments, two different etchants are used to respectively removeinsulating material layer O and sacrificial material layer N. Theetchant of sacrificial material layer N has a sufficient high etchingselectivity over the material of insulating material layer O.Accordingly, insulating material layer O of the dielectric pairunderlying the etched dielectric pair can function as an etch-stop layerso that only the top dielectric pair is patterned/etched. In someembodiments, these top material layers are etched using dry etch, theetchant for sacrificial material layers N includes fluorine (CF₄) basedgases, and the etchant for insulating material layers O includeshexafluoroethane (C₂F₆) based gases. In some embodiments, one etchant(e.g., of timed a wet etch process) is used to remove both sacrificialmaterial layer N and insulating material layer O, and the etchantincludes phosphoric acid. In various embodiments, the methods andetchants to remove the top dielectric pair of dielectric stack 210should not be limited by the embodiments of the present disclosure. Insome embodiments, the PR portions can be removed after the formation ofthe trimming marks.

FIG. 3A illustrates a top view 300 of staircase structure 100 after theremoval of the PR portions and FIG. 3B illustrates a cross-sectionalview of staircase structure 100 along direction 3-3′. As shown in FIGS.3A and 3B, a plurality of trimming marks (e.g., initial trimming marks,each including a layer of insulating material layer O over a layer ofsacrificial material layer N) 306, 307, . . . , 308 can be formed atlocations covered by the PR portions in FIGS. 2A and 2B. In someembodiments, dielectric stack 310 can represent dielectric stack 210after portions of the top dielectric pair are removed and trimming marksare formed from the remaining portions of the top dielectric pair. Asshown in FIG. 3B, the height of a trimming mark can be nominally equalto the thickness of the top dielectric pair. For example, each initialtrimming mark (e.g., 306 or 307) can include a layer of insulatingmaterial and an underlying layer of sacrificial material.

Further, a first PR layer can be formed and patterned over dielectricstack 310 to expose the portion of dielectric stack 310 for forming thefirst staircase-forming area “SC1-forming area” or A1 and an etchingprocess (e.g., a second etching process) can be performed to remove theexposed portion of the top dielectric pair of dielectric stack 310. FIG.4A illustrates a top view 400 of staircase structure 100 after theetching process and FIG. 4B illustrates a cross-sectional view 401 ofstaircase structure 100 along 4-4′ direction. In some embodiments,trimming mark 406 represents trimming mark 306 after the second etchingprocess, and dielectric stack 410 represents dielectric stack 310 afterthe second etching process. The first PR layer, after patterned, isrepresented by element 409.

The second etching process can include any suitable etchant tosequentially remove the exposed top portion of dielectric stack 310.First PR layer 409 can expose A1, where initial trimming mark 306 isformed over. In some embodiments, the second etching process includesusing the initial trimming mark 306 and first PR layer 409 as the etchmask to remove the exposed top dielectric pair (O, N). In someembodiments, the etchants of the material layers can be similar to orsame as the first etching process described in FIGS. 2A and 2B. First PRlayer 409 can expose A1 of the first dielectric pair of dielectric stack310 and can be used as an etch mask for the removal of the exposedportion of the top dielectric pair. After the etch, referring to FIG.4B, trimming mark 406 (e.g., including a layer of insulating materiallayer O over a layer of sacrificial material layer N) can be formed onthe second dielectric pair of dielectric stack 410 and first PR layer409 can be over the remaining portion of the top dielectric pair ofdielectric stack 410. In the subsequent fabrication operations, first PRlayer 409 can be trimmed to allow subsequent etches of underlyingdielectric pairs (O, N). In the present disclosure, arrows (e.g.,pointing to the x-axis) represent the trimming direction of a PR layer,e.g., being along the x-axis. In some embodiments, the trimming of a PRlayer (e.g., first PR layer 409) can be obtained by using an isotropicdry etch.

First PR layer 409 can be trimmed vertically (e.g., along the z-axis)and horizontally (e.g., along the x-axis and the y-axis). In someembodiments, first PR layer 409 is further trimmed to expose the A2 overdielectric stack 410. An etching process (e.g., a third etching process)can be performed on the top dielectric pair of portions exposed by firstPR layer 409 (e.g., A1 and A2). The third etching process can be thesame as or similar to any one of the first etching process and thesecond etching process described in FIGS. 2A-4B. Similarly, first PRlayer 409 can further be trimmed along the x-axis for exposing andetching A3 and A4.

FIG. 5A illustrates a top view 500 of staircase structure 100 after A4has been etched and FIG. 5B illustrates a cross-sectional view 501 ofstaircase structure 100 along 5-5′ direction, according to someembodiments. Second PR layer 509 represents first PR layer 409 after thetrimming and dielectric stack 510 represents dielectric stack 410 afterthe etching of A3 and A4. As shown in FIGS. 5A and 5B, trimming marks506 and 507 can be formed. Trimming marks 506 and 507 can be separatedby two staircases (e.g., exposed portions of dielectric stack 510 forforming A2 and A3) in between along the x-z plane. Second PR layer 509can further be trimmed along the x-axis for the formation of the rest ofthe staircases.

FIG. 6A illustrates a top view 600 of staircase structure 100 after theformation of all the staircases and FIG. 6B illustrates across-sectional view 601 of staircase structure 100 along 6-6′direction, according to some embodiments. The PR layer(s) used for theformation of the staircases can be removed using a suitable wet etchand/or dry etch and top surface 609 of dielectric stack 610 can beexposed to provide a fabrication base for subsequent processingoperations. Dielectric stack 610 represents dielectric stack 510 afterthe etches for the formation of the staircases SC1, SC2, . . . , SCn. Asshown in FIGS. 6A and 6B, trimming marks 606, 607, . . . , 608 can beformed over the staircases of staircase structure 100. The actual PRtrimming rate can be determined based on the locations of the trimmingmarks 606-608, 506-508, 406-408, and/or 306-308, during or after theformation of staircase structure 100. The determined actual PR trimmingrate can be further used to control actual the PR trimming rate for thesame batch of staircase structures or the next batch of staircasestructures. Details can be described in the following paragraphs.

FIGS. 7A, 7B, 8A, 8B, 9A, 9B, 10A, and 10B illustrate another exemplarymethod for forming staircase structure 100, according to someembodiments. Different from the method shown in FIGS. 2A-6B, accordingto the method illustrated in FIGS. 7A-10B, the trimming marks can beformed separately/individually. Each trimming mark can be separatelyformed at a desired location during the formation of the staircasestructure (e.g., with the formation of the staircases).

FIG. 7A illustrates a top view 700 of staircase structure 100 at thebeginning of an exemplary fabrication process and FIG. 7B illustrates across-sectional view of staircase structure 100 along 7-7′ direction,according to some embodiments. At the beginning of the process, asubstrate 105 (not shown in FIGS. 7A-10B) having a dielectric stack 710thereon can be provided. Dielectric stack 710 can be the same as orsimilar to dielectric stack 210. A PR layer can be formed patterned overdielectric stack 710 to form a PR portion 706 over dielectric stack 710.PR portion 706 can be used as an etch mask for the subsequent etch andformation of a trimming mark in the A1.

Further, the portions of the top dielectric pair (O, N) of dielectricstack 710 exposed by PR portion 706 can be removed using similar or thesame etching process as any one of the first etching process, the secondetching process, and the third etching process described in FIGS. 2A-6B,and PR portion 706 can be removed after the etch. A trimming mark (e.g.,initial trimming mark) can be formed in A1. Further, a first PR layercan be formed and patterned over the etched dielectric stack to exposethe A1. The second etching process can be performed to remove theexposed dielectric pair (O, N) of the A1. The second etching process canbe similar to or same as any one of the first etching process, thesecond etching process, and the third etching process described in FIGS.2A-6B.

FIG. 8A illustrates a top view 800 of staircase structure 100 after thesecond etching process and FIG. 8B illustrates a cross-sectional view801 of staircase structure 100 along 8-8′ direction, according to someembodiments. Dielectric stack 810 represents the dielectric stack 710after the second etching process and the first PR layer can berepresented by element 809. As shown in FIGS. 8A and 8B, trimming mark806 can be formed over A1, and A1 is exposed for subsequentetching/processing. Further, first PR layer 809 can be trimmedhorizontally (e.g., along the x-axis) for the etching/formation of otherstaircase-forming areas (e.g., A2 and A3). After a desired number ofstaircase-forming areas are formed, the PR layer for forming thestaircases and over the dielectric stack (e.g., the first PR layer) canbe removed and a subsequent trimming mark can be formed by patterningthe top dielectric pair (O, N) of the dielectric stack.

FIG. 9A illustrates a top view 900 of staircase structure 100 after thePR layer (e.g., the first PR layer) for forming the staircases isremoved, and another PR portion is formed over staircase structure 100for forming a trimming mark over another staircase-forming area, andFIG. 9B illustrates a cross-sectional view of staircase structure 100along 9-9′ direction, according to some embodiments. As an example, PRportion 907 can be formed in A4, after the formation of A1-A3. Trimmingmark 906 represents trimming mark 806 after the etching/processing forA2 and A3. Dielectric stack 910 can be dielectric stack 810 after theetching/formation of A2 and A3. As shown in FIGS. 9A and 9B, PR portion907 can be used as an etch mask for the subsequent etching/formation ofthe trimming mark located in A4.

Further, portions of the dielectric pairs of dielectric stack 910exposed by PR portion 907 can be etched and removed, and PR portion 907can be removed after the etch. The etching process to remove the exposeddielectric pairs (O, N) of dielectric stack 910 can be the same as orsimilar to any one of the first etching process, the second etchingprocess, and the third etching process described in FIGS. 2A-6B. Atrimming mark can then be formed in A4. Further, a second PR layer canbe formed and patterned over the etched dielectric pair to expose A1-A4,and an etching process can be performed to remove portions of thedielectric pairs (O, N) stack exposed by the second PR layer.

FIG. 10A illustrates a top view 1000 of staircase structure 100 afterthe top dielectric pair of dielectric stack 910 is removed to form A4and FIG. 10B illustrates a cross-sectional view of staircase structure100 along 10-10′ direction, according to some embodiments. Dielectricstack 1010 represents dielectric stack 910 after the top dielectric pairof dielectric stack 910 is removed, and the second PR layer isrepresented by element 1009. Trimming marks 1006 and 1007 can be formedin A1 and A4, respectively. Further, second PR layer 1009 can be trimmedhorizontally (e.g., along the x-axis) for the formation of subsequentstaircases. Additional trimming marks can be formed using similarmethods for forming trimming marks 906, 1006, and 1007. In someembodiments, trimming marks can be formed after a PR layer no longer hassufficient thickness (e.g., along the z-axis) and/or width (in the x-yplane) after repetitive trimming is removed and before a subsequent newPR layer is formed and patterned for forming subsequent staircases.

As described above, locations of trimming marks can be determined beforeor during the formation of staircases of a staircase structure.Staircases and trimming marks can further be formed by repetitivelyetching the dielectric pairs (O, N) of the dielectric stack. Because atrimming mark can function as an etch mask or patterning mask for theformation of the trimming mark of the lower adjacent dielectric pairalong the z-axis, the horizontal location of a trimming mark of astaircase can be preserved or stay unchanged during and after theetching processes. Thus, the trimming marks can be used toreflect/measure the actual PR trimming rate during the formation ofstaircases, and the PR trimming parameters can be controlled or adjustedbased on the measurement.

Trimming marks can also have a recessed structure, and the locations ofthe trimming marks with a recessed structure can also be formed beforeor during the formation of staircases. FIGS. 11A, 11B, 12A, 12B, 13A,13B, 14A, and 14B illustrate another exemplary method for formingstaircase structure 100, according to some embodiments. The locations ofthe trimming marks can be formed before the formation of staircases ofstaircase structure 100. Different from the methods shown in FIGS.2A-10B, the trimming marks formed using the method illustrated in FIGS.11A-14B can have a recessed structure.

FIG. 11A illustrates a top view 1100 of staircase structure 100 at thebeginning of a fabrication process for forming trimming marks with arecessed structure and FIG. 11B illustrates a cross-sectional view 1101along the 11-11′ direction, according to some embodiments. At thebeginning of the fabrication process, a substrate 105 having adielectric stack 1110 can be provided. Dielectric stack 1110 can be thesame as or similar to dielectric stack 210 illustrated in FIGS. 2A and2B. A PR layer 1109 can be formed and patterned over dielectric stack1110 to expose patterns (e.g., 1106, 1107, . . . , and 1108) of thesubsequently-formed trimming marks. Further, an etching process can beperformed to remove the portions of the top dielectric pair (O, N) ofdielectric stack 1110 exposed by PR layer 1109. The etching process canbe similar to or the same as any one of the first etching process, thesecond etching process, and the third etching process illustrated inFIGS. 2A-7B. Further, PR layer 1109 can be removed and trimming markscan be formed over the etched dielectric stack.

FIG. 12A illustrates a top view of 1200 of staircase structure 100 aftera plurality of trimming marks are formed over the etched dielectricstack and FIG. 12B illustrates a cross-sectional view 1201 of staircasestructure 100 along 12-12′ direction, according to some embodiments.Dielectric stack 1210 represents dielectric stack 1110 after the topdielectric pair is etched. As shown in FIGS. 12A and 12B, trimming marks1206, 1207, . . . , and 1208 are formed. Different from the trimmingmarks 306, 307, . . . , and 308 illustrated in FIGS. 3A and 3B, thetrimming marks formed in FIGS. 12A and 12B have a recessed structure,and the depth of a trimming mark can be nominally equal to the thicknessof the top dielectric pair (O, N) of dielectric stack 1210. Further, afirst PR layer can be formed and patterned over dielectric stack 1210 toexpose the first staircase-forming area, and the exposed top dielectricpair (O, N) of dielectric stack can be etched and removed.

FIG. 13A illustrates a top view 1300 of staircase structure 100 afterthe top dielectric pair of A1 is removed and FIG. 13B illustrates across-sectional view 1301 along the 13-13′ direction, according to someembodiments. Dielectric stack 1310 represents dielectric stack 1210after the top dielectric pair is etched. First PR layer is representedby element 1309. As shown in FIGS. 13A and 13B, trimming mark 1306 canbe formed in the A1. First PR layer 1309 can be further trimmedhorizontally (e.g., along the x-axis) for the subsequent formation ofstaircases of staircase structure 100. Because a trimming mark canfunction as an etch mask or patterning mask for the formation of thetrimming mark of the lower adjacent dielectric pair along the z-axis,the locations of the trimming marks formed in FIGS. 12A and 12B can bepreserved during the fabrication process.

FIG. 14A illustrates a top view 1400 of staircase structure 100 afterall the staircases are formed, according to some embodiments. FIG. 14Billustrates a cross-sectional view 1401 along 14-14′ direction.Dielectric stack 1410 represents dielectric stack 1310 after theformation of the staircases (SC1, SC2, . . . , SCn) and the trimmingmarks. Top surface 1409 of dielectric stack 1410 can be exposed toprovide the fabrication base for the subsequent fabrication of staircasestructure 100. As shown in FIGS. 14A and 14B, trimming marks 1406, 1407,. . . , 1408 can be formed over the staircases of staircase structure100. The actual PR trimming rate can be determined based on thelocations of the trimming marks, e.g., 1206-1208, 1306-1308, and/or1406-1408, during or after the formation of staircase structure 100. Thedetermined actual PR trimming rate can be further used to control thenext trimming of the PR layer in the same batch of staircase structuresor the next batch of staircase structures. Details can be described inthe following paragraphs.

FIGS. 15A, 15B, 16A, 16B, 17A, and 17B illustrate another exemplarymethod for forming staircase structure 100 having trimming marks with arecessed structure, according to some embodiments. Different from themethod shown in FIGS. 11A-14B, according to the method illustrated inFIGS. 15A-17B, the trimming marks can be formed separately/individually.Each trimming mark can be separately formed at a desired location duringthe formation of the staircase structure.

FIG. 15A illustrates a top view 1500 of staircase structure 100 at thebeginning of an exemplary fabrication process and FIG. 15B illustrates across-sectional view of staircase structure 100 along 15-15′ direction.At the beginning of the fabrication process, substrate 105 havingdielectric stack 1510 over substrate 105 can be provided. A PR layer1509 can be formed and patterned over dielectric stack 1510 to exposethe pattern of a trimming mark over the A1. Patterned PR layer 1509 canfunction as an etch mask in the subsequent etching of the top dielectricpair (O, N) of dielectric stack 1510 such that portion 1506 of the topdielectric pair exposed by patterned PR layer 1509 can be removed toform a trimming mark (e.g., an initial trimming mark).

Further, the portions of top dielectric pair of dielectric stack 1510exposed by patterned PR layer 1509 can be removed using similar or thesame etching process as any one of the first etching process, the secondetching process, and the third etching process described in FIGS. 2A-6B,and patterned PR layer 1509 can be removed after the etch. A trimmingmark can be formed in the first staircase-forming area. Further, a firstPR layer can be formed and patterned over the etched dielectric stack toexpose the first staircase-forming area. A second etching process can beperformed to remove the exposed portion/area of the top dielectric pair(O, N). The second etching process can be similar to or the same as anyone of the first etching process, the second etching process, and thethird etching process described in FIGS. 2A-6B.

FIG. 16A illustrates a top view 1600 of staircase structure 100 afterthe exposed portion of top dielectric pair is removed and FIG. 16Billustrates a cross-sectional view 1601 of staircase structure 100 along16-16′ direction, according to some embodiments. Dielectric stack 1610represents dielectric stack 1510 after the exposed portion of topdielectric pair (O, N) are removed. The first PR layer is represented byelement 1609. As shown in FIGS. 16A and 16B, trimming mark 1606 can beformed over A1, and A1 is exposed for subsequent etching/processing.Further, first PR layer 1609 can be trimmed horizontally (e.g., alongthe x-axis) for the etching/formation of other staircase-forming areas(e.g., A2 and A3). After a desired number of staircase-forming areas areformed, the PR layer for forming the staircases and over the dielectricstack (e.g., the first PR layer) can be removed and a subsequenttrimming mark can be formed by patterning the top dielectric pair (O, N)of the dielectric stack.

FIG. 17A illustrates a top view 1700 of staircase structure 100 afterall the staircases are formed, according to some embodiments. FIG. 17Billustrates a cross-sectional view 1701 along 17-17′ direction.Dielectric stack 1710 represents dielectric stack 1310 after theformation of the staircases (SC1, SC2, . . . , SCn) and the trimmingmarks. As shown in FIGS. 17A and 17B, trimming marks 1706, 1707, . . . ,1708 can be formed over the staircases of staircase structure 100. Theactual PR trimming rate of PR layer 1709 can be determined based on thelocations of the trimming marks, e.g., 1606-1608 and/or 1706-1708,during or after the formation of staircase structure 100. The determinedactual PR trimming rate can be further used to control the next trimmingof the PR layer in the same batch of staircase structures or the nextbatch of staircase structures. The working principles of trimming markshaving a recessed structure can be the same as or similar to the workingprinciples of trimming marks having a protruding structure. Details ofthe working principles are described below.

In some embodiments, the sacrificial layers are replaced by conductorlayers after the formation of staircase structure 100 is completed. Theconductor layers are insulated from one another by the insulating layersin between. The conductor layers can form the gate electrodes (e.g.,word lines) of the 3D memory device.

In some embodiments, trimming marks described in FIGS. 2A-17B can alsobe formed over a neighboring area, e.g., a dummy staircase structure ora neighboring planar area on the same substrate the staircase structureis formed. In the present disclosure, the term “neighboring” can referto any suitable location/region that is on the same substrate andundergoes the same etching process as the staircase structure. Aneighboring area/region can be adjacent to an object (e.g., thestaircase structure) or away from the object. For example, a dummystaircase structure, e.g., adjacent to staircase structure 100, can beformed at the same time when staircase structure 100 is formed. Same PRlayers can be used to form the staircases of the dummy staircasestructure so that the trimming marks formed over the dummy staircasestructure can reflect the actual PR trimming rate. Measurement based onthe trimming marks can thus be taken place using the dummy staircasestructure without changing the topography of staircase structure 100.

FIGS. 18 and 19 illustrate another exemplary staircase structure 100having trimming marks formed in a neighboring planar region, accordingto some embodiments. For example, the neighboring planar region can alsobe referred to as a test region or a dummy region, and the region toform the functioning staircase structure can be referred to as a deviceregion. The trimming marks can be formed to reflect the actual PRtrimming rate for forming staircases. For illustrative purposes, only aportion of staircase structure 100 and the dummy region is shown. Insome embodiments, the trimming marks in a neighboring planar region canbe formed at the same time as the trimming marks over staircasestructure 100, e.g., before the etching of the dielectric stack.

As shown in FIG. 18, staircase structure 100 can be formed in deviceregion 1806, and a plurality of trimming marks (e.g., 1801, 1802, . . ., 1803) can be formed in dummy region 1807. The trimming marks can beformed before or during the formation of staircase structure 100. Insome embodiments, staircase structure 100 can be formed using a PR layer1805, which is being trimmed vertically and horizontally (e.g., alongthe x-axis and the y-axis) to form staircases of staircase structure100. In some embodiments, the trimming marks can be formed using aseparate PR layer followed by an etching process, similar to or same asany one of the first etching process, the second etching process, andthe third etching mask illustrated in FIGS. 2A-7B. The trimming markscan be distributed in any suitable pattern, e.g., along the x-axis,along a direction having an angle to the x-axis, or in an irregularpattern. In some embodiments, the trimming marks are each aligned withthe middle position of a staircase along the x-axis. Because thelocations of the trimming marks can stay unchanged during the formationof staircase structure 100, measurement based on the trimming marks,during or after the formation of staircase structure 100, can be used toreflect the actual PR trimming rate.

FIG. 19 illustrates an enlarged view 1900 of the circled area in FIG.18, according to some embodiments. As shown in FIG. 19,staircase-forming areas A1-A4 can be formed in staircase structure 100.Trimming marks 1901 and 1902 can be formed at the same locations oftrimming marks 1801 and 1802 before the formation of A1-A4. Trimmingmark 1901 can be designed to be aligned with the middle position of A1along the x-axis, and trimming mark 1902 can be designed to be alignedwith the middle position of A4 along the x-axis. As an example, distanceD1 between A1 and A2 along the x-axis can be measured and compared withdistance D2 between the centers (e.g., geometric centers) or edges ofthe same side of trimming marks 1901 and 1902 along the x-axis. If thedistances are nominally the same, the actual PR trimming rate along thex-axis is nominally the same as the estimated PR trimming rate along thex-axis. If the difference between the distances are sufficiently large,the actual PR trimming rate along the x-axis is different from theestimated PR trimming rate along the x-axis. The PR trimming parametersalong the x-axis can then be adjusted accordingly. Depending on thelocations of the trimming marks, PR trimming rates along differentdirections can be measured using different trimming marks as references.In another example, distance D3 between the center of trimming mark 1901and PR layer 1905 along the x-axis and/or distance D4 between the centerof trimming mark 1902 and PR layer 1905 along the x-axis can be measuredand compared with estimated distances to determine the differencebetween the actual PR trimming rate and the estimated PR trimming ratealong the x-axis. The PR trimming parameters along the x-axis can beadjusted based on the result of the comparison. In some embodiments,distance D5 between the center of trimming mark 1902 and PR layer 1905along the y-axis can be measured to determine the actual PR trimmingrate along the y-axis. In some embodiments, trimming marks can be formedat other locations surrounding or adjacent to the staircases for anysuitable measurements. The specific locations and patterns of thetrimming marks should not be limited by the embodiments of the presentdisclosure. Other measurements of the actual PR trimming rate using thetrimming marks as references should also be within the scope of thepresent disclosure. In some embodiments, trimming marks are formed overstaircase structure 100 and neighboring/surrounding staircase structure100 for measuring of PR trimming rate along different directions.

FIG. 20 illustrates a cross-sectional view 2000 of staircase structure100, according to some embodiments. The working principles of trimmingmarks formed over staircases can be described in detail. As shown inFIG. 20, staircase structure 100 includes a dielectric stack 2004 andtrimming marks 2001 and 2002 distributed over A1 and A4, respectively. APR layer 2003, for forming staircases can be formed over the top surfaceof dielectric stack 2004. In some embodiments, PR layer 2003 is trimmedhorizontally (along the x-axis) and vertically (along the z-axis). Insome embodiments, the distance (D6 and/or D7) between an edge of atrimming mark (e.g., 2001 and/or 2002) and a horizontal edge of PR layer2003 is measured to determine the actual PR trimming rate along thedirection (e.g., a horizontal direction or the x-axis) that points fromthe trimming mark to the horizontal edge of PR layer 2003, at a desiredtime (during the formation of the staircases and/or after the formationof the staircases). The determined/measured actual PR trimming rate canbe compared to the estimated/calculated PR trimming rate to determinewhether the actual PR trimming rate is nominally the same as theestimated PR trimming rate. Based on the result of comparison, the PRtrimming rate can be adjusted, e.g., by changing etching power, etchantflow rates, etc. In various embodiments, the specific ways to form thetrimming marks can vary. For example, trimming marks can be formed fromdepositing and patterning a layer of materials different from thesacrificial material and the insulating material over the dielectricstack. The patterning of the trimming marks can be performed before theetching of the staircases. The locations and/or patterns of the trimmingmarks can stay unchanged during and/or after the fabrication process.The specific ways to form the trimming marks should not be limited bythe embodiments of the present disclosure.

The actual PR trimming rate can be monitored in real-time or measuredafter the etching of one batch of staircase structures is completed. Forexample, cameras and/or optical means can be used to monitor desireddistances during the etching of staircases and/or after the etching ofthe staircases. The measured actual PR trimming rate can then be used toadjust or control the PR trimming parameters of the current batch ornext batch of staircase structures. Thus, the PR layers can be trimmedat a more controllable rate, and the etching of the staircases can bemore controllable.

FIGS. 21A and 21B each illustrates an exemplary 3D memory structure, insome embodiments. FIGS. 21A and 21B illustrate another application ofthe trimming marks provided by the present disclosure. In someembodiments, the first distance between a first trimming mark and the PRlayer before trimming is measured, during the formation of a staircasestructure. The PR layer can then be trimmed. The first trimming mark andthe trimmed PR layer can then be used as etch masks to etch thedielectric stack. Further, a second trimming mark, formed from etchingthe dielectric stack using the first trimming mark as the etch mask, canbe formed, and one or more staircases can be formed between the secondtrimming mark and the trimmed PR layer. A second distance between thesecond trimming mark and the trimmed PR layer can be measured. The firstdistance can then be compared to the second distance to obtain the width(e.g., the measured horizontal width) of the one or more staircases. Themeasured width can then be compared with the designed width of the oneor more staircases, and a deviation/difference between the measuredwidth and the designed width can be obtained. This difference can beused to reflect whether the actual PR trimming rate (e.g., along thehorizontal direction) is higher/lower than or nominally the same as theestimated/calculated PR trimming rate. PR trimming parameters can beadjusted based on the difference. For example, the amount of adjustmentcan be based on the value of the difference. Further, the adjusted PRtrimming parameters can be used to control the trimming of the PR layerin subsequent etches of staircases of the same batch or a differentbatch. Thus, the widths of the staircases can be more preciselycontrolled to approach the designed widths. In some embodiments, theadjustment of PR trimming parameters can be performed one or more times(e.g., forming a feedback loop).

FIG. 21A illustrates the cross-sectional view 2101 of structure 100having a first trimming mark 2102 over dielectric stack 2104 in A1, anda PR layer 2103 is formed over dielectric stack 2104. PR layer 2103represents the PR layer before trimming, and the distance between firsttrimming mark 2102 and PR layer 2103 is D8. In some embodiments,trimming mark 2102 is formed at the edge of A1 and distance D8 isdefined as the distance between the edge of trimming mark 2102 (e.g., atthe edge of A1) and PR layer 2103. PR layer 2103 can be trimmed (e.g.,horizontally or along the x-axis) and be used as an etch mask for theetching of dielectric stack 2104. First trimming mark 2101 can be usedas an etch mask for forming one or more trimming marks at the samehorizontal location.

FIG. 21B illustrates the cross-sectional view 2102 of structure 100after PR layer 2103 is trimmed and used as an etch mask for the etchingof dielectric stack 2104. Dielectric stack 2114 represents dielectricstack 2104 after the etching. PR layer 2105 represents PR layer 2103after the trimming and the etching of dielectric stack 2104. A2 can beformed by the etching process. A second trimming mark 2104 can be formedusing first trimming mark 2103 as the etch mask. The distance betweensecond trimming mark 2104 and PR layer 2105 can be D9. In someembodiments, the difference between D8 and D9 can be D10, whichrepresents the measured width of A2 or the measured width of asubsequently-formed staircase in A2. D10 can further be compared with adesigned width of a staircase-forming area or a staircase to determinewhether the PR trimming rate is higher/lower than or nominally the sameas the estimated/calculated/expected PR trimming rate.

For example, if D10 is greater than the designed width, the PR trimmingrate can be too high. The PR trimming parameters, such as gas flow rateand etching power, can be adjusted (e.g., tuned down), and vice versa.If D10 is nominally the same as the designed width, the PR trimmingparameters can remain the same. In some embodiments, a threshold valuecan be used to determine whether the PR trimming parameters can beadjusted based on the difference. In an example, if the difference(e.g., absolute difference value) between D10 and the designed width isgreater than a threshold value, the difference is considered “non-zero”and the difference is used to generate the feedback control value toadjust the PR trimming parameters. The threshold value can be apercentage (e.g., 5% of the designed width) or an absolute value (e.g.,0.5 nm). In some embodiments, if the difference is within (e.g., smallerthan or equal to) the threshold value, the difference is considered“zero” and no feedback control value is generated.

In various embodiments, the adjustment of PR trimming parameters can beperformed more than one time. For example, the PR layer can berepetitively trimmed and the distance between trimming marks at acertain location and the trimmed PR layer can be repetitively measuredand compared to designed widths of staircase-forming areas orstaircases. Accordingly, the PR trimming parameters can be adjustedrepetitively, if necessary. In some embodiments, more than one trimmingmarks can be used to adjust the PR trimming parameters. For example, themore than one trimming marks can be distributed in the horizontal planeto adjust the PR trimming rate at different locations. In an example,the trimming marks are aligned along a line in the x-y plane, and theline can have an angle to the x-axis and the y-axis. PR trimming ratesas a function along the x-axis and the y-axis can be reflected using thedisclosed method. In another example, the trimming marks can also beformed over a region neighboring the dielectric stack (e.g., over adummy staircase structure and/or a planar region, as shown in FIGS. 18and 19). In this case, similar operations can be performed to adjust thePR trimming parameters. Thus, the PR trimming rate can be more preciselycontrolled and the widths of the staircases can be closer to thedesigned value. In some embodiments, the adjustment of PR trimming ratecan be performed during the formation of a staircase structure. Themethod can be used to monitor/control the PR trimming rate for thecurrent batch of staircase structure, and/or the PR trimming rate forthe subsequent batches of staircase structures.

In various embodiments, the working principles of trimming marks can beused in other applications. For example, any suitable reference markscan be formed in an etching process for etching control. The object ofwhich the etch rate is being monitored or being controlled (e.g., the PRlayer) and the reference marks (e.g., the trimming marks) can be formedat different regions/locations. Any suitable measurements (e.g., thedistance between a reference mark and the object) can be used to reflectthe deviation of actual etch rate from the estimated etch rates.Accordingly, etching parameters (e.g., RF power, etchant flow rates, andchamber pressure) can be adjusted to allow the actual etch rate toapproach the estimated etch rate.

In some embodiments, the dielectric stack (e.g., dielectric stack 210)can also have a plurality of (N, O) pairs stacking alternatingly. Forexample, the top dielectric pair can be formed over or neighboring thestaircases. The trimming marks can also include a recessed structure,which is formed in a dielectric pair. The thickness/depth of a trimmingmark can be equal to the thickness of a dielectric pair. Details offorming staircases of (N, O) pairs can be referred to the description ofFIGS. 2A-17B and are not repeated herein.

Embodiments of the present disclosure further provide a method forforming trimming marks in/with a staircase structure. FIG. 22illustrates an exemplary process flow for forming trimming marks,according to some embodiments. For explanation purposes, the operationsshown in method 2200 are described in the context of FIGS. 2A-18. Invarious embodiments of the present disclosure, the operations of method2200 can be performed in a different order and/or vary.

At operation 2201, a substrate and a dielectric stack over the substrateare provided.

In some embodiments, the substrate can include any suitable material forforming the 3D memory structure. For example, the substrate can includesilicon, silicon germanium, silicon carbide, silicon on insulator (SOI),germanium on insulator (GOI), glass, gallium nitride, gallium arsenide,and/or other suitable III-V compounds.

In some embodiments, the dielectric stack includes an alternating stackof sacrificial material layers “N” and insulating material layers “O”,arranged vertically (along the z-axis) over the substrate. A sacrificialmaterial layer and the underlying insulating material layer forms adielectric pair. In some embodiments, sacrificial material layers Ninclude any suitable material different from insulating material layersO. For example, sacrificial material layers N can includepoly-crystalline silicon, silicon nitride, poly-crystalline germanium,and/or poly-crystalline germanium-silicon. In some embodiments,sacrificial material layers N include silicon nitride. Insulatingmaterial layers O can include any suitable insulating materials, e.g.,silicon oxide. The dielectric stack can be formed by alternatinglydepositing sacrificial material layers and insulating material layersover the substrate. The deposition of sacrificial material layers andinsulating material layers can include any suitable deposition methodssuch as CVD, PVD, PECVD, sputtering, MOCVD, and/or ALD. In someembodiments, the sacrificial material layers and the insulating materiallayers are each formed by CVD.

At operation 2202, a plurality of trimming marks are formed over and/orneighboring the dielectric stack. The trimming marks can be formed bypatterning the dielectric stack and/or patterning a region (e.g., a testregion or a dummy region) neighboring the dielectric stack. The trimmingmarks can have any suitable shapes, arrangement patterns, and number,and can be formed at any suitable locations depending on the fabricationrequirements. In some embodiments, the shapes of trimming marks can varyat different locations, e.g., for measurement purposes. The trimmingmarks can have a protruding structure or a recessed structure. In someembodiments, a trimming mark can be formed by etching a dielectric pair,and the height of a protruding trimming mark and the depth of a recessedtrimming mark are each equal to the thickness of a dielectric pair. Thetrimming marks can be formed before and/or during the formation ofstaircases from the dielectric stack. The formation of trimming markscan be referred to the description of FIGS. 2A-17B.

At operation 2203, a staircase structure can be formed based on thedielectric stack using one or more PR layers. The staircase structurecan be formed by repetitively trimming the PR layer and etching thedielectric pairs of the dielectric stack using the PR layer as the etchmask. The sacrificial material layers and the insulating material layerscan be etched by any suitable etchants. In some embodiments, the etchantof the insulating material layers has desirably high selectivity overthe sacrificial material layers so that the etching of one dielectricpair can stop at the lower adjacent dielectric pair, and the etching ofthe dielectric stack can be more precisely controlled. In someembodiments, each trimming mark can function as an etch mask or apatterning mask for the etching of the lower adjacent dielectric pair sothat the locations of the trimming marks can stay unchanged during theetches. The formation of the staircase structure can be referred to thedescription of FIGS. 2A-17B. In some embodiments, operation 2202 and2203 can be performed at the same time.

At operation 2204, the difference between the actual PR trimming rateand the estimated PR trimming rate can be determined using the trimmingmarks as references and the PR trimming parameters can be adjusted basedon the difference. The difference between the actual PR trimming ratefor forming the current batch of staircase structures can be reflectedin difference in the measured widths and designed widths ofstaircases/staircase-forming areas, using the trimming marks asreferences. The measured widths can be compared with the predetermineddesigned widths to determine whether the actual PR trimming rate isnominally the same as the estimated PR trimming rate. The PR trimmingparameters for etching the next batch or subsequent dielectric pairs canbe adjusted based on the result of the comparison. Details of theworking principles of the trimming marks can be referred to in thedescription of FIGS. 18-21.

Embodiments of the present disclosure further provide a method forcontrolling and monitoring the actual PR trimming rate in the 3D memorystructure fabrication. FIG. 23 illustrates an exemplary method 2300 forforming trimming marks, according to some embodiments. For explanationpurposes, the operations shown in method 2300 are described in thecontext of FIGS. 2A-21. In various embodiments of the presentdisclosure, the operations of method 2300 can be performed in adifferent order and/or vary.

At operation 2301, a layout of one or more trimming marks is determined.The layout of the trimming marks can include locations of the trimmingmarks. In some embodiments, the trimming marks can be formed over orneighboring a dielectric stack that is to be processed/etched.

At operation 2302, the one or more trimming marks are formed beforeand/or during the formation of a staircase structure based on thelayout. In some embodiments, the staircase structure can be formed basedon the dielectric stack using a PR layer that is trimmed during thefabrication process. The trimming marks can have any suitable shapes,arrangement patterns, and number, and can be formed at any suitablelocations depending on the fabrication requirements. In someembodiments, the shapes of trimming marks can vary at differentlocations, e.g., for measurement purposes. The trimming marks can have aprotruding structure or a recessed structure. In some embodiments, thelocations of the trimming marks stay unchanged during the fabricationprocess.

At operation 2303, the difference between the actual PR trimming rateand the estimated PR trimming rate is determined using the trimmingmarks as references, and the PR trimming parameters are adjusted basedon the difference. In some embodiments, the comparison of trimming ratescan be obtained by a comparison between one or more measured widths andone or more designed widths using the trimming marks as references. Ifthe actual PR trimming rate is higher or lower than the estimated PRtrimming rate, the PR trimming parameters can be adjusted, e.g., bychanging the etching power and/or etchant gas flows, to approach theestimated PR trimming rate for etching of the current batch of staircasestructures or the next batch of staircase structures. In someembodiments, the value or scale of the difference can be used toproportionally adjust the PR trimming parameters. For example, a greaterdifference can lead to a greater change in the PR trimming parameters,and vice versa.

In some embodiments, operation 2303 can include a feedback loop 2400 forcontinuing to adjust the PR trimming parameters so that the actual PRtrimming rate can constantly approach the estimated PR trimming rate.FIG. 24 illustrates an exemplary feedback loop for adjusting the PRtrimming parameters, according to some embodiments.

At operation 2401, the difference between a measured width and adesigned width can be determined using one or more trimming marks asreferences. In some embodiments, the difference between the actual PRtrimming rate and the estimated PR trimming rate is reflected in thedifference between the measured width and the designed width. In someembodiments, the difference can be greater than, equal to, or smallerthan zero.

At operation 2402, it is determined whether the estimated PR trimmingrate is nominally equal to the actual PR trimming rate.

At operation 2403, if the estimated PR trimming rate is nominally equalto the actual PR trimming rate, the PR trimming parameters can bemaintained.

At operation 2404, if the estimated PR trimming rate is different fromthe actual PR trimming rate, the PR trimming parameters are adjustedbased on the difference between the measured width and the designedwidth and the loop returns to operation 2401.

In some embodiments, if the difference (e.g., absolute difference value)between the actual PR trimming rate and the estimated PR trimming rateis greater than a threshold value, the difference is considered“non-zero” and the difference is used to generate the feedback controlvalue to adjust the PR trimming parameters. For example, the thresholdvalue can be a percentage (e.g., 5% of the estimated PR trimming rate)or an absolute value (e.g., 0.5 nm). In some embodiments, if thedifference is within (e.g., smaller than or equal to) the thresholdvalue, the difference is considered “zero” and no feedback control valueis generated.

In various embodiments, the methods and structures provided by thepresent disclosure can also be used in other applications such as etchrate control in various semiconductor fabrications, etc. The specificapplication of the method and structure should not be limited by theembodiments of the present disclosure.

By using the disclosed feedback loop, the actual PR trimming rate canconstantly approach/follow the estimated PR trimming rate. Accordingly,the trimming of the PR layer can be more controllable, and the widths ofthe staircases can be closer to design. In some embodiments, feedbackloop 2400 and/or at least part of method 2300 are performed usingsuitable software and/or hardware. For example, measuring tools such ascameras and/or optical means can be used to obtain desired parameters,e.g., distances, and a computer can be used to determine differences indistances. The computer can further determine the difference between theactual PR trimming rate and the estimated PR trimming rate and adjustthe PR trimming parameters by controlling the gas valves and/or radiofrequency (RF) power supply of the reaction chamber, to adjust actualthe PR trimming rate.

In the present disclosure, a trimming mark over an area/object can referto a trimming mark with a protruding structure formed on the area/objector a trimming mark with a recessed structure formed in the area/object.

In some embodiments, a method for controlling a PR trimming rate in a PRtrimming process includes, providing a substrate, forming a PR layerover a first region of the substrate, and forming a first trimming markover a second region neighboring the first region. The method alsoincludes trimming the PR layer, measuring a first distance between thefirst trimming mark and the PR layer along a first direction parallel toa top surface of the substrate to determine an actual PR trimming rateof the PR trimming process along the first direction, comparing theactual PR trimming rate along the first direction with an estimated PRtrimming rate along the first direction to determine a first differencebetween the actual PR trimming rate along the first direction and theestimated PR trimming rate along the first direction, and adjusting oneor more PR trimming parameters of the PR trimming process based on thefirst difference.

In some embodiments, a method for controlling a PR trimming rate in a PRtrimming process includes providing an estimated PR trimming rate,determining an actual PR trimming rate, and comparing the actual PRtrimming rate and the estimated PR trimming rate to determine adifference between the actual PR trimming rate and the estimated PRtrimming rate. In response to the difference being greater than athreshold, one or more PR trimming parameters for the PR trimmingprocess are adjusted so that the actual PR trimming rate is same as theestimated PR trimming rate.

In some embodiments, a method for controlling a PR trimming rate in a PRtrimming process for forming a 3D memory structure includes forming adielectric stack over a substrate, the dielectric stack including aplurality of sacrificial material layers and a plurality of insulatingmaterial layers arranged alternatingly, trimming a PR layer over thedielectric stack, etching the dielectric stack, using the trimmed PRlayer as an etch mask, to form a plurality of staircases, and forming afirst trimming mark for the trimmed PR layer. The method also includesmeasuring a first distance between the first trimming mark and thetrimmed PR layer along a first direction parallel to the top surface ofthe substrate to determine an actual PR trimming rate of the PR trimmingprocess along the first direction, comparing the actual PR trimming ratealong the first direction with an estimated PR trimming rate along thefirst direction to determine a first difference between the actual PRtrimming rate along the first direction and the estimated PR trimmingrate along the first direction, and adjusting one or more PR trimmingparameters of the PR trimming process based on the first difference.

In some embodiments, a 3D memory structure includes a substrate, astaircase structure disposed over the substrate, the staircase structureincluding a plurality of conductor layers and a plurality of insulatinglayers arranged alternatingly. In some embodiments, a conductor layerand an insulating layer adjacent to the conductor layer form astaircase, and a first trimming mark over one or more of the staircasestructure and a region neighboring the staircase structure over thesubstrate, wherein the first trimming mark has one or more of aprotruding structure and a recessed structure.

In some embodiments, a method for controlling a PR trimming rate in a PRtrimming process for forming a three-dimensional memory structureincludes forming a dielectric stack over a substrate, the dielectricstack including a plurality of sacrificial material layers and aplurality of insulating material layers arranged alternatingly. In someembodiments, a PR layer is disposed over the dielectric stack. In someembodiments, the method further includes forming a first trimming markfor the PR layer, measuring a first distance between the first trimmingmark and the PR layer along a first direction parallel to the topsurface of the substrate, trimming the PR layer along the firstdirection, and etching the dielectric stack, using the trimmed PR layeras an etch mask, to form a staircase. In some embodiments, the methodfurther includes forming a second trimming mark, using the firsttrimming mark as an etch mask, for the trimmed PR layer, measuring asecond distance between the second trimming mark and the trimmed PRlayer along the first direction, comparing the first distance with thesecond distance to determine a difference between an actual PR trimmingrate and an estimated PR trimming rate along the first direction, andadjusting one or more PR trimming parameters of the PR trimming processbased on the difference.

The foregoing description of the specific embodiments will so fullyreveal the general nature of the present disclosure that others can, byapplying knowledge within the skill of the art, readily modify and/oradapt for various applications such specific embodiments, without undueexperimentation, without departing from the general concept of thepresent disclosure. Therefore, such adaptations and modifications areintended to be within the meaning and range of equivalents of thedisclosed embodiments, based on the teaching and guidance presentedherein. It is to be understood that the phraseology or terminologyherein is for the purpose of description and not of limitation, suchthat the terminology or phraseology of the present specification is tobe interpreted by the skilled artisan in light of the teachings andguidance.

Embodiments of the present disclosure have been described above with theaid of functional building blocks illustrating the implementation ofspecified functions and relationships thereof. The boundaries of thesefunctional building blocks have been arbitrarily defined herein for theconvenience of the description. Alternate boundaries can be defined solong as the specified functions and relationships thereof areappropriately performed.

The Summary and Abstract sections may set forth one or more but not allexemplary embodiments of the present disclosure as contemplated by theinventor(s), and thus, are not intended to limit the present disclosureand the appended claims in any way.

The breadth and scope of the present disclosure should not be limited byany of the above-described exemplary embodiments, but should be definedonly in accordance with the following claims and their equivalents.

What is claimed is:
 1. A method for controlling a photoresist (PR)trimming rate in a PR trimming process, comprising: forming a PR layerover a first region of a substrate; forming a first trimming mark over asecond region of the substrate neighboring the first region; trimmingthe PR layer; measuring a first distance between the first trimming markand the PR layer along a first direction parallel to a top surface ofthe substrate to determine an actual PR trimming rate of the PR trimmingprocess along the first direction; comparing the actual PR trimming ratealong the first direction with an estimated PR trimming rate along thefirst direction to determine a first difference between the actual PRtrimming rate along the first direction and the estimated PR trimmingrate along the first direction; and adjusting one or more PR trimmingparameters of the PR trimming process based on the first difference. 2.The method of claim 1, wherein: the first trimming mark is formed bypatterning the second region of the substrate; the first trimming markcomprises one or more of a protruding structure and a recessedstructure; and the first trimming mark comprises a rectangular shape, acircular shape, an irregular shape, a squared shape, and a combinationthereof.
 3. The method of claim 2, further comprising: forming a secondtrimming mark over the second region; measuring a second distancebetween the second trimming mark and the PR layer along a seconddirection parallel to the top surface of the substrate to determine anactual PR trimming rate of the PR trimming process along the seconddirection; comparing the actual PR trimming rate along the seconddirection with an estimated PR trimming rate along the second directionto determine a second difference between the actual PR trimming ratealong the second direction and the estimated PR trimming rate along thesecond direction; and adjusting the one or more PR trimming parametersof the PR trimming process based on the second difference.
 4. The methodof claim 3, wherein: the first direction and the second direction aredifferent from one another.
 5. The method of claim 4, wherein: thesecond trimming mark and the first trimming mark are formed by a samepatterning process; and the second trimming mark and the first trimmingmark have same or different shapes.
 6. The method claim 5, wherein thesecond region comprises one or more of a planar surface and athree-dimensional surface.
 7. A three-dimensional (3D) memory structure,comprising: a substrate; a staircase structure disposed over thesubstrate, the staircase structure comprising a plurality of conductorlayers and a plurality of insulating layers arranged alternatingly,wherein a conductor layer and an insulating layer adjacent to theconductor layer form a staircase; and a first trimming mark over one ormore of the staircase structure and a region neighboring the staircasestructure over the substrate, wherein the first trimming mark has one ormore of a protruding structure and a recessed structure.
 8. Thestructure of claim 7, wherein the first trimming mark has a samethickness as the staircase.
 9. The structure of claim 8, wherein thefirst trimming mark is over one staircase of the staircase structure.10. The structure of claim 9, wherein the first trimming mark comprisesa rectangular shape, a circular shape, an irregular shape, a squaredshape, or a combination thereof.
 11. The structure of claim 9, furthercomprising a second trimming mark disposed over another staircase of thestaircase structure, the second trimming mark having a same thicknessand same shape as the first trimming mark.
 12. The structure of claim11, wherein: staircases of the staircase structure are aligned along afirst direction; and the first trimming mark and the second trimmingmark are aligned along a direction that has an angle to the firstdirection.
 13. A method for controlling a photoresist (PR) trimming ratein a PR trimming process for forming a three-dimensional memorystructure, comprising: forming a dielectric stack over a substrate, thedielectric stack comprising a plurality of sacrificial material layersand a plurality of insulating material layers arranged alternatingly,wherein a PR layer is disposed over the dielectric stack; forming afirst trimming mark for the PR layer; measuring a first distance betweenthe first trimming mark and the PR layer along a first directionparallel to the top surface of the substrate; trimming the PR layeralong the first direction; etching the dielectric stack, using thetrimmed PR layer as an etch mask, to form a staircase; forming a secondtrimming mark, using the first trimming mark as an etch mask, for thetrimmed PR layer; measuring a second distance between the secondtrimming mark and the trimmed PR layer along the first direction;comparing the first distance with the second distance to determine adifference between an actual PR trimming rate and an estimated PRtrimming rate along the first direction; and adjusting one or more PRtrimming parameters of the PR trimming process based on the difference.14. The method of claim 13, wherein forming a first trimming markcomprises forming the first trimming mark over one or more of thedielectric stack and a region neighboring the dielectric stack.
 15. Themethod of claim 14, wherein forming the first trimming mark comprises:patterning the one or more of the dielectric stack and the regionneighboring the dielectric stack to form an initial trimming mark; andetching, repetitively, the dielectric stack using the initial trimmingmark as an etch mask to form the first trimming mark.
 16. The method ofclaim 13, wherein the first trimming mark has one or more of aprotruding structure and a recessed structure.
 17. The method of claim16, wherein the protruding structure includes a height of a thickness ofa staircase and the recessed structure includes a depth of the thicknessof the staircase.
 18. The method of claim 14, wherein the region overthe dielectric stack and the region neighboring the dielectric stackinclude one or more of a planar surface and a three-dimensional surface.19. The method of claim 13, further comprising: controlling the trimmingof the trimmed PR layer based on the adjusted one or more PR trimmingparameters; and etching the dielectric stack using the trimmed PR layeras an etch mask to form an other staircase.
 20. The method of claim 13,further comprising: controlling a trimming of an other PR layer based onthe adjusted one or more PR trimming parameters; and etching an otherdielectric stack using the other trimmed PR layer as an etch mask toform an other staircase.